Manufacture of semiconductor device

Abstract

PURPOSE:To improve the reliability of a semiconductor element without forming points in heating adhesion, by using a segment of thermoplastic resin film as the bonding member by perforating holes for air espcape. CONSTITUTION:As the material of the bonding member 4 which adheres the back of the semiconductor element 3 to the supporting member 2, a thermoplastic resin having a glass transition point of 160 deg.C or more and a thermal decomposition start temperature of 350 deg.C or more, preferably a glass transition point of 180 deg.C or more and a thermal decomposition start temperature of 390 deg.C ore more, e.g. aromatic polyether amide, aromatic polyester, polysulphone, polyphenylenesulfild, polyethyerimide, or polyether etherketone is used. Since this bonding member has several holes, air can escape through the holes in heating adhesion even when air interposes between the supporting member and the bonding member; therefore, the generation of boides can be prevented.

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